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281
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
J. S. Bae, G. H. Chang, J. H. Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
282
Accuracy Analysis of Image Orientation Technique and Direct Georeferencing Technique
Accuracy Analysis of Image Orientation Technique and Direct Georeferencing Technique
Sang-Keun Bae, Byung-Guk Kim, | 한국GIS학회 | 2005 ,
283
The Impact of Price Promotion Cues on the Formation of Expected Price
The Impact of Price Promotion Cues on the Formation of Expected Price
Sang Wook Bae, | (사)한국마케팅관리학회 | 2000 ,
284
Customer Loyalty Transferability as a Mediator in the Success of the Acquisition and Strategic Alliance
Customer Loyalty Transferability as a Mediator in the Success of the Acquisition and Strategic Alliance
Jai-Kwan Park, Sang Wook Bae, | (사)한국마케팅관리학회 | 2001 ,
285
Immobilization and Detection Techniques for Biosensors
Immobilization and Detection Techniques for Biosensors
Young Min Bae, Seong In Cho, Yong-Jin Cho, | 한국산업식품공학회 | 2003 ,
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