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1
Thermal Dephasing of Quasi-Phase-Matched Second-Harmonic Generation in Periodically Poled Stoichiometric LiTaO₃ at High Input Power
Thermal Dephasing of Quasi-Phase-Matched Second-Harmonic Generation in Periodically Poled Stoichiometric LiTaO₃ at High Input Power
Nan Ei Yu, | 한국물리학회 | 2006 ,
2
Temporal Dependence and Spatial Distribution of the Temperature Rise in an Acoustic Field Detected by an Array Thermal Probe
Temporal Dependence and Spatial Distribution of the Temperature Rise in an Acoustic Field Detected by an Array Thermal Probe
Yong Tae Kim., | 한국물리학회 | 2006 ,
3
mproved Thin-Film Multi-Junction Thermal Converters for Low-Frequency Performance
mproved Thin-Film Multi-Junction Thermal Converters for Low-Frequency Performance
Young Hwa Lee., | 한국물리학회 | 2006 ,
4
Optical Characterization of Ge Quantum Dots Grown by Using Rapid Thermal Chemical Vapor Deposition
Optical Characterization of Ge Quantum Dots Grown by Using Rapid Thermal Chemical Vapor Deposition
Min Choul Kim., | 한국물리학회 | 2006 ,
5
Effect of Thermal Annealing on the Performance of P3HT/PCBM Polymer Photovoltaic Cells
Effect of Thermal Annealing on the Performance of P3HT/PCBM Polymer Photovoltaic Cells
Kim, Heejoo, | 한국물리학회 | 2006 ,
6
Thermal Properties and Viscous-Flow Behavior of Bulk Amorphous Mg59.0Cu28.9Pd1.2Y10.9 Alloy
Thermal Properties and Viscous-Flow Behavior of Bulk Amorphous Mg59.0Cu28.9Pd1.2Y10.9 Alloy
Hwang, In-sun, | 한국물리학회 | 2006 ,
7
A Boundary Element Solution Approach for the Conjugate Heat Transfer Problem in Thermally Developing Region of a Thick Walled Pipe
A Boundary Element Solution Approach for the Conjugate Heat Transfer Problem in Thermally Developing Region of a Thick Walled Pipe
Chang-Yong Choi., | 대한기계학회 | 2006 ,
8
Effects of Faster Airflows on Human Thermal Comfort in Summer
Effects of Faster Airflows on Human Thermal Comfort in Summer
Listiani Nurul Huda., | 대한건축학회 | 2006 ,
9
Analytical Thermal Noise Model of Deep-Submicron MOSFETs
Analytical Thermal Noise Model of Deep-Submicron MOSFETs
Hyungcheol Shin., | 대한전자공학회 | 2006 ,
10
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Yong Min Kwon, | 대한금속재료학회 | 2006 ,
처음1234567이후마지막
1
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [, ]
2
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [공학, ]
3
Journal of Thermal Analysis & Calorimetry
Kluwer Academic Publishing / Academic [, ]
4
Journal of Thermal Stresses
Taylor & Francis Ltd [, ]
5
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [공학, ]
6
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [, ]
7
Thermal Science
Society of Thermal Engineers of Serbia [, ]