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1
A Paddling Based Locomotive Mechanism for Capsule Endoscopes
A Paddling Based Locomotive Mechanism for Capsule Endoscopes
Sukho Park., | 대한기계학회 | 2006 ,
2
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Young Kun Jee, | 대한금속재료학회 | 2006 ,
3
Advanced Pad Conditioner Design for Exide/Metal CMP
Advanced Pad Conditioner Design for Exide/Metal CMP
Taewook Hwang, | 한국전기전자재료학회 | 2006 ,
4
Difference in Growth, Yield and Isoflavone Content among Soybean Cultivars under Drained Paddy Field Condition
Difference in Growth, Yield and Isoflavone Content among Soybean Cultivars under Drained Paddy Field Condition
Sang-Uk Chon, Dong-Kwan Kim, | 한국작물학회 | 2006 ,
5
Soybean Growth and Yield as Affected by Spacing of Drainage Furrows in Paddy Field
Soybean Growth and Yield as Affected by Spacing of Drainage Furrows in Paddy Field
Jin Woong Cho, Jung-June Lee, Young-Jin Oh, Jung, | 한국작물학회 | 2006 ,
6
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Jin-Won Choi,Ho-Seob Cha, | 대한금속.재료학회 | 2003 ,
처음1마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
3
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Schulz-Kirchner Verlag GmbH [, ]