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1
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Yong Min Kwon, | 대한금속재료학회 | 2006 ,
2
Preparation and Properties of TiC-Ni Cermets Using Ni-Plated TiC
Preparation and Properties of TiC-Ni Cermets Using Ni-Plated TiC
Soon-Gi Shin, | 대한금속.재료학회 | 2002 ,
처음1마지막
1
Canadian Journal of Urban Research
University of Winnipeg / Institute of Urban Studies [, ]
2
ICONIP : International Conference On Neural Information Processing
대한전자공학회 [, ]
3
ICONIP : International Conference On Neural Information Processing
대한전자공학회 [공학, ]
4
Journal of Manipulative & Physiological Therapeutics
Mosby Yearbook Inc. [, ]
5
Journal of Manual & Manipulative Therapy (Journal of Manual & Manipulative Therapy)
Journal of Manual & Manipulative Therapy [, ]
6
Journal of Manual & Manipulative Therapy (Journal of Manual & Manipulative Therapy)
Journal of Manual & Manipulative Therapy [, ]
7
스마트 디바이스 트렌드
정보통신기술진흥센터 [정보통신기술진흥센터, NIPA, IITP, 정보통신기술진흥센터, 모바일, 스마트, 디바이스, 웨어러블, 창조경제, 크라우드펀딩, 미디어플로우,, ]