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1
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Jae Woong Choi, Gil Ho Hwang, Won Kyu Han, Sung G, | Korean Institute of Metals and Materials | 2006 ,
2
High Temperature Deformation Mechanism and Evolution of Dislocation Structure during Creep of Ni-Base Superalloy 713LC
High Temperature Deformation Mechanism and Evolution of Dislocation Structure during Creep of Ni-Base Superalloy 713LC
In Soo Kim, Baia Gyu Choi, Seong Moon Seo, Chang, | Korean Institute of Metals and Materials | 2006 ,
3
Effect of Dilution on the Behavior of Solidification Cracking in PTSW Overlay Deposit on Ni-Base Superalloys
Effect of Dilution on the Behavior of Solidification Cracking in PTSW Overlay Deposit on Ni-Base Superalloys
YongSoo Ahn,Byunghyun Yoon, | 대한금속.재료학회 | 2002 ,
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