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1
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
K. W. Lee, | 대한금속재료학회 | 2006 ,
2
An Interpretation of the Failure Paths of Roughened Matal-Polymer Interfaces
An Interpretation of the Failure Paths of Roughened Matal-Polymer Interfaces
Ho-Young Lee,Jianmin qu, | 대한금속.재료학회 | 2001 ,
3
Fracture of Copper-Based leadframe/EMC Interfaces
Fracture of Copper-Based leadframe/EMC Interfaces
Ho Young Lee, | 대한금속.재료학회 | 2000 ,
처음1마지막
1
Composite Interfaces
VSP International Science Publishers [, ]
2
산업공학 (IE interfaces)
대한산업공학회 [, ]
3
산업공학 (IE interfaces)
대한산업공학회 [공학, ]