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1
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
K. W. Lee, | 대한금속재료학회 | 2006 ,
2
Personal computer interfaces
Personal computer interfaces
Hordeski, Michael, 566.5-H811p | McGraw-Hill | 1995 566.5-H811p,
3
Developing user interfaces : ensuring usability through product & process
Developing user interfaces : ensuring usability through product & process
Hix, Deborah, 005.12-H676d | J. Wiley | 1993 005.12-H676d,
4
Designing effective speech interfaces
Designing effective speech interfaces
Weinschenk, Susan., 569.91-W424d | John Wiley & Sons | 2000 569.91-W424d,
5
An Interpretation of the Failure Paths of Roughened Matal-Polymer Interfaces
An Interpretation of the Failure Paths of Roughened Matal-Polymer Interfaces
Ho-Young Lee,Jianmin qu, | 대한금속.재료학회 | 2001 ,
6
Fracture of Copper-Based leadframe/EMC Interfaces
Fracture of Copper-Based leadframe/EMC Interfaces
Ho Young Lee, | 대한금속.재료학회 | 2000 ,
7
User Interfaces in C and C+ : For OS/2
User Interfaces in C and C+ : For OS/2
Coodwin, Mark, 004.794-C769u | ICEG | 1993 004.794-C769u,
8
User Interfaces in C and C+
User Interfaces in C and C+
Goodwin, Mark, 004.794-G657u | ICEG | 1992 004.794-G657u,
9
Physics and Chemistry of III-V Compound Semiconductor Interfaces
Physics and Chemistry of III-V Compound Semiconductor Interfaces
Wilmsen, Carl W, 420-W744p | Plenum | 1985 420-W744p,
10
Lipid and Biopolymer Monolayers at Liquid Interfaces
Lipid and Biopolymer Monolayers at Liquid Interfaces
Birdi, K S, 422.4-B618l | Plenum | 1989 422.4-B618l,
처음12이후마지막
1
Composite Interfaces
VSP International Science Publishers [, ]
2
산업공학 (IE interfaces)
대한산업공학회 [, ]
3
산업공학 (IE interfaces)
대한산업공학회 [공학, ]