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1
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Yong Min Kwon, | 대한금속재료학회 | 2006 ,
2
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Jae Woong Choi, Gil Ho Hwang, Won Kyu Han, Sung G, | Korean Institute of Metals and Materials | 2006 ,
3
Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment
Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment
T. H. Song, J. K. Lee, S. Y. Park, | 한국부식방식학회(구)한국부식학회 | 2005 ,
4
Removal and Recovery of Nickel Ion from Wastewater of Electroless Plating by Reduction Crystallization
Removal and Recovery of Nickel Ion from Wastewater of Electroless Plating by Reduction Crystallization
Ken Horikawa, Izumi Hirasawa, | 한국화학공학회 | 2000 ,
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