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1
Modified-VSIMM algorithm with an application to the naval fire control technology
Modified-VSIMM algorithm with an application to the naval fire control technology
Zhuang, H. Q, | 제어자동화시스템공학회 | 2010 ,
2
Fuzzy logic control to suppress noises and coupling effects in a laser tracking system
Fuzzy logic control to suppress noises and coupling effects in a laser tracking system
Ying Bai, | Institute of Electrical and Electronics Engineers | 2005 ,
3
Comments on "Discrete-time variable structure controller with a decoupled disturbance compensator and its application to a CNC servomechanism"
Comments on "Discrete-time variable structure controller with a decoupled disturbance compensator and its application to a CNC servomechanism"
Keqing Zhang, | Institute of Electrical and Electronics Engineers | 2003 ,
4
H2 optimal reduced order control design using a fuzzy logic methodology with bounds on system variances
H2 optimal reduced order control design using a fuzzy logic methodology with bounds on system variances
Majura F. Selekwa, | Institute of Electrical and Electronics Engineers | 2003 ,
5
Rethinking ERP success: A new perspective from knowledge management and continuous improvement
Rethinking ERP success: A new perspective from knowledge management and continuous improvement
T.C. McGinnis, | North-Holland | 2007 ,
6
Diamond Conditioner Wear Characterization for a Copper CMP Process
Diamond Conditioner Wear Characterization for a Copper CMP Process
L. Boruckia, | 한국전기전자재료학회 | 2008 ,
7
Regular Paper : Physics of the Coefficient of Friction in CMP
Regular Paper : Physics of the Coefficient of Friction in CMP
Len Borucki, | 한국전기전자재료학회 | 2008 ,
8
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
9
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Yun Zhuang, | 한국전기전자재료학회 | 2008 ,
10
Wireless communications and networking
Wireless communications and networking
Mark, Jon W., 568-M345w | Prentice Hall | 2003 568-M345w,
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