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7 Results:AA:EUI GOO CHANG NAM HOON KIM 0.265 sec.
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1
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Tae Gun Kim, | 한국전기전자재료학회 | 2005 ,
2
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
3
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
4
Investigations on the Etching of Platinum Film using High Density Inductively Coupled Ar/Cl2/HBr Plasmas
Investigations on the Etching of Platinum Film using High Density Inductively Coupled Ar/Cl2/HBr Plasmas
Nam Hoon Kim, | 한국전기전자재료학회 | 2001 ,
5
Regular Paper / A Study on Pumping Effect of Oxygen in Polysilicon Gate Etching
Regular Paper / A Study on Pumping Effect of Oxygen in Polysilicon Gate Etching
Nam Hoon Kim, | 한국전기전자재료학회 | 2001 ,
6
Stability of H2O2 as an Oxidizer for Cu CMP
Stability of H2O2 as an Oxidizer for Cu CMP
Do Won Lee, | 한국전기전자재료학회 | 2005 ,
7
A Study on the Optimized Copper Electrochemical Plating in Dual Damascene Process
A Study on the Optimized Copper Electrochemical Plating in Dual Damascene Process
Hae Young Yoo, | 한국전기전자재료학회 | 2005 ,
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