본문

  1. Home
23 Results:AA:B ZHU 0.140 sec.
RSS 
다국어입력
 상세검색
 신착검색
선택출력 선택엑셀내보내기
1
Fuzzy logic control to suppress noises and coupling effects in a laser tracking system
Fuzzy logic control to suppress noises and coupling effects in a laser tracking system
Ying Bai, | Institute of Electrical and Electronics Engineers | 2005 ,
2
bFGF-Modified BMMSCs enhance bone regeneration following distraction osteogenesis in rabbits
bFGF-Modified BMMSCs enhance bone regeneration following distraction osteogenesis in rabbits
Jiang, X., | Elsevier Inc | 2010 ,
3
Effects of 50Hz sinusoidal electromagnetic fields of different intensities on proliferation, differentiation and mineralization potentials of rat osteoblasts
Effects of 50Hz sinusoidal electromagnetic fields of different intensities on proliferation, differentiation and mineralization potentials of rat osteoblasts
Zhou, J., | Elsevier Inc | 2011 ,
4
Creative destruction Zhu Jia Jiao, China
Creative destruction Zhu Jia Jiao, China
Bei Huang, H. Y., | Pergamon | 2007 ,
5
When Closer is Better: The Influence of Physical Distance on Consumer Judgment of Product Effectiveness
When Closer is Better: The Influence of Physical Distance on Consumer Judgment of Product Effectiveness
Li X, | Association for Consumer Research | 2011 ,
6
Impact on Online-store Loyalty from Store Image under Influences from Consumption Values
Impact on Online-store Loyalty from Store Image under Influences from Consumption Values
Song, Y, | Association for Consumer Research | 2007 ,
7
Service robot feature design effects on uesr perceptions and emotional responses
Service robot feature design effects on uesr perceptions and emotional responses
Tao Zhang, | Springer | 2010 ,
8
Diamond Conditioner Wear Characterization for a Copper CMP Process
Diamond Conditioner Wear Characterization for a Copper CMP Process
L. Boruckia, | 한국전기전자재료학회 | 2008 ,
9
Regular Paper : Physics of the Coefficient of Friction in CMP
Regular Paper : Physics of the Coefficient of Friction in CMP
Len Borucki, | 한국전기전자재료학회 | 2008 ,
10
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
처음123이후마지막