본문

  1. Home
2 Results:SS:NIB 0.31 sec.
RSS 
Multilingual
 Расширенный поиск
 Новый поиск книги прибытия
Selected Print Select Export to Excel
1
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Jae Woong Choi, Gil Ho Hwang, Won Kyu Han, Sung G, | Korean Institute of Metals and Materials | 2006 ,
2
High Temperature Deformation Mechanism and Evolution of Dislocation Structure during Creep of Ni-Base Superalloy 713LC
High Temperature Deformation Mechanism and Evolution of Dislocation Structure during Creep of Ni-Base Superalloy 713LC
In Soo Kim, Baia Gyu Choi, Seong Moon Seo, Chang, | Korean Institute of Metals and Materials | 2006 ,
처음1마지막