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1
Novel Properties of Erbium-Silicided N-Type Schottky Barrier Metal-Oxide -Semiconductor Field-Effect Transistors
Novel Properties of Erbium-Silicided N-Type Schottky Barrier Metal-Oxide -Semiconductor Field-Effect Transistors
Moongyu Jang, Yakyeon Kim, Jaeheon Shin, Seongjae, | 대한전자공학회 | 2004 ,
2
Fluid Effects on the Core Seismic Behavior of a Liquid Metal Reactor
Fluid Effects on the Core Seismic Behavior of a Liquid Metal Reactor
Gyeong-Hoi Koo, Jae-Han Lee, | 대한기계학회 | 2004 ,
3
A Comparative Study on the Web Marketing Mix Strategy of the Global e-commerce Meta-mediary
A Comparative Study on the Web Marketing Mix Strategy of the Global e-commerce Meta-mediary
Yongrok Choi, | Korea Trade Research Association Inc. | 2004 ,
4
The Role of Modeling in the Development of Advanced Processes for Metallic Aerospace Alloys
The Role of Modeling in the Development of Advanced Processes for Metallic Aerospace Alloys
S. L. Semiatin, P. A. Kobryn, O. M. Ivasishin, H., | 대한금속.재료학회 | 2004 ,
5
Recent Progress in Improving Ductility of Ultra-High Strength Nanostructured Metals
Recent Progress in Improving Ductility of Ultra-High Strength Nanostructured Metals
E. Ma, | 대한금속.재료학회 | 2004 ,
6
Analysis of Carbon Metabolism in Transgenic Arabidopsis thaliana Transformed with the Cyanobacterial Sucrose Phosphate Synthase Gene
Analysis of Carbon Metabolism in Transgenic Arabidopsis thaliana Transformed with the Cyanobacterial Sucrose Phosphate Synthase Gene
Seok-Yoon Yoon, Jang-Wook Lee, Seong-Hee Bhoo, Jo, | 한국식물학회 | 2004 ,
7
Fictive Stress Model Based Finite Element Analysis for Bulk Metallic Glasses at an Elevated Temperature
Fictive Stress Model Based Finite Element Analysis for Bulk Metallic Glasses at an Elevated Temperature
Hyoung Seop Kim, | 대한금속.재료학회 | 2004 ,
8
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
J.H. Choy, | 대한금속.재료학회 | 2004 ,
9
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
J.H. Choy, K.L. Kavanagh, Y.C. Kim, | 대한금속.재료학회 | 2004 ,
10
Metabolic Syndrome and Life Style in China
Metabolic Syndrome and Life Style in China
PY Wu, XM Song, QL Jin, | 대한지역사회영양학회 | 2004 ,
처음12이후마지막
1
Applied Earth Science: Transactions of the Institution of Mining & Metallurgy, Section B
Maney Publishing [, ]
2
Applied Physiology, Nutrition & Metabolism
NRC Research Press [, ]
3
Current Medical Literature: Growth, Growth Hormone, & Metabolism
Remedica Medical Education & Publishing [, ]
4
Diabetes and Metabolism Journal (DMJ)
대한당뇨병학회 [의학, ]
5
Diabetes, Obesity & Metabolism
Blackwell Publishing Limited [, ]
6
Drug Metabolism Reviews
Marcel Dekker Inc. [, ]
7
Endocrinology and Metabolism(구 대한내분비학회지)
대한내분비학회 [의학, ]
8
International Journal of Obesity & Related Metabolic Disorders
Nature Publishing Group [, ]
9
Journal of Metamorphic Geology
Blackwell Publishing Limited [, ]
10
Metallurgist
Kluwer Academic Publishing / Academic [, ]
11
Metals and Materials International (MMI)
대한금속재료학회(구 대한금속학회) [기계공학, ]
12
Metal Science & Heat Treatment
Kluwer Academic Publishing / Academic [, ]
13
Metalsmith
Society of North American Goldsmiths [, ]
14
Metaphilosophy
Blackwell Publishing Limited [, ]
15
Metaphor & Symbol
Lawrence Erlbaum Associates [, ]
16
Metaphor & Symbolic Activity
Lawrence Erlbaum Associates [, ]
17
Metascience
Blackwell Publishing Limited [, ]
18
Mineral Processing & Extractive Metallurgy Review
Taylor & Francis Ltd [, ]
19
Mineral Processing & Extractive Metallurgy: Transactions of the Institution of Mining & Metallurgy, Section C
Maney Publishing [, ]
20
Nutrition & Metabolism
BioMed Central [, ]