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1
Transient Response of a Permeable Crack Normal to a Piezoelectric-elastic Interface : Anti-plane Problem
Transient Response of a Permeable Crack Normal to a Piezoelectric-elastic Interface : Anti-plane Problem
Soon Man Kwon, Kang Yong Lee, | 대한기계학회 | 2004 ,
2
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
J.H. Choy, | 대한금속.재료학회 | 2004 ,
3
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
J.H. Choy, K.L. Kavanagh, Y.C. Kim, | 대한금속.재료학회 | 2004 ,
4
Vertical Vibration Analysis of Soil-pile Interaction System Considering the Soil-pile Interface Behavior
Vertical Vibration Analysis of Soil-pile Interaction System Considering the Soil-pile Interface Behavior
Min Kyu Kim, Jong Seh Lee, Moon Kyum Kim, | 대한토목학회 | 2004 ,
처음1마지막
1
Composite Interfaces
VSP International Science Publishers [, ]
2
산업공학 (IE interfaces)
대한산업공학회 [, ]
3
산업공학 (IE interfaces)
대한산업공학회 [공학, ]