본문

  1. Home
1000 Results:AA:LEE G 0.249 sec.
RSS 
다국어입력
 상세검색
 신착검색
선택출력 선택엑셀내보내기
951
Histological and Ultrastructural Study of Susceptible and Age-related Resistance Responses of Pepper Leaves to Colletotrichum coccodes Infection
Histological and Ultrastructural Study of Susceptible and Age-related Resistance Responses of Pepper Leaves to Colletotrichum coccodes Infection
Jeum Kyu Hong, | 한국식물병리학회 | 2001 ,
952
Isolation and Differential Expression of an Acidic PR-1 cDNA Gene from Soybean Hypocotyls Infected with Phytophthora sojae f. sp. glycines
Isolation and Differential Expression of an Acidic PR-1 cDNA Gene from Soybean Hypocotyls Infected with Phytophthora sojae f. sp. glycines
Choong Seo Kim, | 한국식물병리학회 | 2000 ,
953
Population Structure and Race Variation of the Rice Blast Fungus
Population Structure and Race Variation of the Rice Blast Fungus
Seogchan Kang, | 한국식물병리학회 | 2000 ,
954
Nucleotide Sequence of Coat Protein Gene of Kyuri Green Mottle Mosaic Virus Isolated from Zucchini
Nucleotide Sequence of Coat Protein Gene of Kyuri Green Mottle Mosaic Virus Isolated from Zucchini
Su Heon Lee, | 한국식물병리학회 | 2000 ,
955
Insertional Mutation of the Rice Blast Resistance Gene, Pi-b, by Long Terminal Repeat of a Retrotransposon
Insertional Mutation of the Rice Blast Resistance Gene, Pi-b, by Long Terminal Repeat of a Retrotransposon
Nam-Soo Jwa, | 한국식물병리학회 | 2000 ,
956
Ultrastructure of Compatible and Incompatible Interactions of Pumpkin Stems Infected with Phytophthora capsici
Ultrastructure of Compatible and Incompatible Interactions of Pumpkin Stems Infected with Phytophthora capsici
Byung Kook Lee, | 한국식물병리학회 | 2001 ,
957
Regular Paper : Characterization of Silver Saturated-Ge45Te55 Solid Electrolyte Films Incorporated by Nitrogen for Programmable Metallization Cell Memory Device
Regular Paper : Characterization of Silver Saturated-Ge45Te55 Solid Electrolyte Films Incorporated by Nitrogen for Programmable Metallization Cell Memory Device
Soo Jin Lee, | 한국전기전자재료학회 | 2008 ,
958
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
959
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Yun Zhuang, | 한국전기전자재료학회 | 2008 ,
960
Regular Paper : A Study on Synthetic Failure-finding Method for Electrical and Thermal Degradation of Polymer Insulator by Surface Discharge
Regular Paper : A Study on Synthetic Failure-finding Method for Electrical and Thermal Degradation of Polymer Insulator by Surface Discharge
Kang Won Lee, | 한국전기전자재료학회 | 2008 ,
처음이전919293949596979899100이후마지막