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901
Comparison of Latin Hypercube Sampling and Simple Random Sampling Applied to Neural Network Modeling of HfO2 Thin Film Fabrication
Comparison of Latin Hypercube Sampling and Simple Random Sampling Applied to Neural Network Modeling of HfO2 Thin Film Fabrication
Jung Hwan Lee, | 한국전기전자재료학회 | 2007 ,
902
The Designing of an Air-gap Type FBAR Filter using Leach Equivalent Model
The Designing of an Air-gap Type FBAR Filter using Leach Equivalent Model
Hyung Wook Choi, | 한국전기전자재료학회 | 2007 ,
903
Demonstration of Alternative Fabrication Techniques for Robust MEMS Device
Demonstration of Alternative Fabrication Techniques for Robust MEMS Device
Sung Pil Chang, | 한국전기전자재료학회 | 2007 ,
904
Effect of Particle Size of Ceria Coated Silica and Polishing Pressure on Chemical Mechanical Polishing of Oxide Film
Effect of Particle Size of Ceria Coated Silica and Polishing Pressure on Chemical Mechanical Polishing of Oxide Film
Hwan Chul Kim, | 한국전기전자재료학회 | 2007 ,
905
Dishing and Erosion Evaluations of Tungsten CMP Slurry in the Orbital Polishing System
Dishing and Erosion Evaluations of Tungsten CMP Slurry in the Orbital Polishing System
Sang Ho Lee, | 한국전기전자재료학회 | 2007 ,
906
Liquid Crystal Alignment Effects on Nitrogen-doped Diamond like Carbon Layer by Ion Beam Alignment Method
Liquid Crystal Alignment Effects on Nitrogen-doped Diamond like Carbon Layer by Ion Beam Alignment Method
Jeong Min Han, | 한국전기전자재료학회 | 2008 ,
907
Passivation Layers for Organic Thin-film-transistors
Passivation Layers for Organic Thin-film-transistors
Ho Nyeon Lee, | 한국전기전자재료학회 | 2008 ,
908
Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System
Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System
Hyosang Lee, | 한국전기전자재료학회 | 2008 ,
909
Effect of Channel Length in LDMOSFET on the Switching Characteristic of CMOS Inverter
Effect of Channel Length in LDMOSFET on the Switching Characteristic of CMOS Inverter
Zhi Yuan Cui, | 한국전기전자재료학회 | 2008 ,
910
Diamond Conditioner Wear Characterization for a Copper CMP Process
Diamond Conditioner Wear Characterization for a Copper CMP Process
L. Boruckia, | 한국전기전자재료학회 | 2008 ,
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