본문

  1. Home
1000 Results:AA:LEE M 0.423 sec.
RSS 
Multilingual
 Расширенный поиск
 Новый поиск книги прибытия
Selected Print Select Export to Excel
831
X-ray Response Characteristic of Zn in the Polycrystalline Cd1-xZnxTe Detector for Digital Radiography
X-ray Response Characteristic of Zn in the Polycrystalline Cd1-xZnxTe Detector for Digital Radiography
Sang Sik Kang, | 한국전기전자재료학회 | 2003 ,
832
Luminance Characteristics of a Novel Red - Light - Emitting Device Based on Znq2 and Dye
Luminance Characteristics of a Novel Red - Light - Emitting Device Based on Znq2 and Dye
Min Jeong Cho, | 한국전기전자재료학회 | 2003 ,
833
Figure of Merit for Deposition Conditions in ITO Films
Figure of Merit for Deposition Conditions in ITO Films
H. H. Kim, | 한국전기전자재료학회 | 2003 ,
834
Alignment Effects for Nematic Liquid Crystal on a New Diamond - like Carbon Layer
Alignment Effects for Nematic Liquid Crystal on a New Diamond - like Carbon Layer
Yong Min Jo, | 한국전기전자재료학회 | 2003 ,
835
Regular paper : Electrical Properties of Organic / Inorganic Hybrid Composites for Insulation Materials
Regular paper : Electrical Properties of Organic / Inorganic Hybrid Composites for Insulation Materials
Sang Cheol Kim, | 한국전기전자재료학회 | 2003 ,
836
Regular paper : Fabrication of Field - Emitter Arrays using the Mold Method for FED Applications
Regular paper : Fabrication of Field - Emitter Arrays using the Mold Method for FED Applications
Kyung Jea Cho, | 한국전기전자재료학회 | 2003 ,
837
Regular paper : p-n Heterojunction Composed of n-ZnO / p-Zn-doped InP
Regular paper : p-n Heterojunction Composed of n-ZnO / p-Zn-doped InP
Eun Sub Shim, | 한국전기전자재료학회 | 2003 ,
838
Regular Paper : A New SOI LIGBT Structure with Improved Latch - Up Performance
Regular Paper : A New SOI LIGBT Structure with Improved Latch - Up Performance
Woong Je Sung, | 한국전기전자재료학회 | 2002 ,
839
Regular Paper : Surface Treatment of Polymer Materials and Transparent Conductive Films
Regular Paper : Surface Treatment of Polymer Materials and Transparent Conductive Films
Bong Ju Lee, | 한국전기전자재료학회 | 2002 ,
840
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
처음이전79808182838485868788이후마지막