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571
Unsteady Aerodynamic Loads on High Speed Trains Passing by Each Other
Unsteady Aerodynamic Loads on High Speed Trains Passing by Each Other
Jaeho Hwang,Dong-Ho Lee, | 대한기계학회 | 2000 ,
572
Fault Detection of the Cylindrical Plunge Grinding Process By Using the Parameters of AE Signals
Fault Detection of the Cylindrical Plunge Grinding Process By Using the Parameters of AE Signals
Jae-Seob Kwak,Ji-Bok Song, | 대한기계학회 | 2000 ,
573
A Parametric Study of Displacement Measurements Using Digital Image Correlation Method
A Parametric Study of Displacement Measurements Using Digital Image Correlation Method
Kuen-Dong Ha, | 대한기계학회 | 2000 ,
574
Thermal Stain Analysis of Composite Materials by Electronic Speckle Pattern Interferometry
Thermal Stain Analysis of Composite Materials by Electronic Speckle Pattern Interferometry
Koung Suk Kim,Wan Shik Jang, | 대한기계학회 | 2000 ,
575
Direct Numerical Simulation of 3-Dimensional Axial Turbulent Boundary Layers with Spanwise Curvature
Direct Numerical Simulation of 3-Dimensional Axial Turbulent Boundary Layers with Spanwise Curvature
Dong Shin Shin, | 대한기계학회 | 2000 ,
576
Evaluation of Thermal Deformation in Electronic Packages
Evaluation of Thermal Deformation in Electronic Packages
Hyeon Gyu Beom, | 대한기계학회 | 2000 ,
577
Model Reference Adaptive Control of a Time-Varying Parabolic System
Model Reference Adaptive Control of a Time-Varying Parabolic System
Keum-Shik Hong, | 대한기계학회 | 2000 ,
578
Computational Method for Dynamic Analysis of Constrained Mechanical Systems Using Parial Velocity Matrix Trasformation
Computational Method for Dynamic Analysis of Constrained Mechanical Systems Using Parial Velocity Matrix Trasformation
Jung Hun Park,Hong Hee Yoo, | 대한기계학회 | 2000 ,
579
Engineered Surfaces Part 1. - A Philosophy of Manufacture
Engineered Surfaces Part 1. - A Philosophy of Manufacture
Kenneth.J.Stout, | 대한기계학회 | 2000 ,
580
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Jin-Won Choi,Ho-Seob Cha, | 대한금속.재료학회 | 2003 ,
처음이전53545556575859606162이후마지막
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AAO-HNSF Patient of the Month Program
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2
Acta Orthopaedica
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3
Acta Orthopaedica
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Acta Orthopaedica Scandinavica
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Acta Orthopaedica Scandinavica
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Acta Orthopaedica (Supplement)
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Acta Orthopaedica (Supplement)
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Acta Paediatrica
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Acta Paediatrica. Supplement
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Active & Passive Electronic Components
Taylor & Francis Ltd [, ]
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Acts Passed by the General Assembly of Louisiana, 1865
Great Neck Publishing [, ]
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Addiction Biology
Carfax Publishing Company [, ]
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Adult Literacy
US Department of Education [, ]
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Adultspan: Theory Research & Practice
American Counseling Association [, ]
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Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
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Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
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Advanced Packaging
Penn Well Publishing Co. [, ]
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Advanced Placement (AP) Examinations
US Department of Education [, ]
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Advances in Complex Systems
World Scientific Publishing Company [, ]
20
Advances in Speech Language Pathology
Taylor & Francis Ltd [, ]