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132 Results:AA:SANG HO KIM 0.187 sec.
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31
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
32
Experiment of Drifting Mobilities of Holes and Electrons in Stabilized a-Se Film
Experiment of Drifting Mobilities of Holes and Electrons in Stabilized a-Se Film
Sang Sik Kang, | 한국전기전자재료학회 | 2004 ,
33
Synthesis and Luminescence Characterization of Eu3+ Doped Gd2O3 Phosphors by Combustion Method
Synthesis and Luminescence Characterization of Eu3+ Doped Gd2O3 Phosphors by Combustion Method
Young Ho Jeong, | 한국전기전자재료학회 | 2004 ,
34
Thermal Stability and Electrical Properties of HfOxNy, Gate Dielectrics with TaN Gate Electrode
Thermal Stability and Electrical Properties of HfOxNy, Gate Dielectrics with TaN Gate Electrode
Jeon Ho Kim, | 한국전기전자재료학회 | 2004 ,
35
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
36
Regular paper : Current - Voltage - Luminance Characteristics Depending on a Direction of Applied Voltage in Organic Light - Emitting Diodes
Regular paper : Current - Voltage - Luminance Characteristics Depending on a Direction of Applied Voltage in Organic Light - Emitting Diodes
Sang Keol Kim, | 한국전기전자재료학회 | 2003 ,
37
Temperature - Dependent Photoluminescence from Er-implanted undoped and Mg-doped GaN
Temperature - Dependent Photoluminescence from Er-implanted undoped and Mg-doped GaN
Sang Sig Kim, | 한국전기전자재료학회 | 2001 ,
38
Current-voltage (1-5) Characteristics of the Molecular Electronic Devices using Various Organic Molecules
Current-voltage (1-5) Characteristics of the Molecular Electronic Devices using Various Organic Molecules
Ja Ryong Koo, | 한국전기전자재료학회 | 2005 ,
39
Magnetic Abrasive Polishing for Internal Face of STS Tube using Sludge Abrasive Grain
Magnetic Abrasive Polishing for Internal Face of STS Tube using Sludge Abrasive Grain
Hee Nam Kim, | 한국전기전자재료학회 | 2005 ,
40
Stability of H2O2 as an Oxidizer for Cu CMP
Stability of H2O2 as an Oxidizer for Cu CMP
Do Won Lee, | 한국전기전자재료학회 | 2005 ,
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