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21
Electrotribological Behavior of Cu-Ag-Zr Contact Wire against Copper-Base Strip
Electrotribological Behavior of Cu-Ag-Zr Contact Wire against Copper-Base Strip
S. G. Jia, P. Liu, F. Z. Ren, B. H. Tian, M. S. Z, | Metals and Materials | 2005 ,
22
Interpretaion of Evaporation Behavior of Lead from Molten Copper by the Mass-Transfer Model in Fluid Flow
Interpretaion of Evaporation Behavior of Lead from Molten Copper by the Mass-Transfer Model in Fluid Flow
Woo-Gwang Jung, Ho-Sang Sohn, | 대한금속.재료학회 | 2005 ,
23
Evaluation of Aluminum and Copper Biosorption in Two-Metal System using Algal Biosorbent
Evaluation of Aluminum and Copper Biosorption in Two-Metal System using Algal Biosorbent
Hak Sung Lee, Bohumil Volesky, | The Korean Environmental Sciences Societ | 1998 ,
24
Effects of the Insect Growth Regulator Dimilin on the Survival Rate of Larvae, Adults, and Egg Viability of Tigriopus japonicus Mori (Copepoda ; Harpacticoida)
Effects of the Insect Growth Regulator Dimilin on the Survival Rate of Larvae, Adults, and Egg Viability of Tigriopus japonicus Mori (Copepoda ; Harpacticoida)
Kyung-Hwa Choi, Myung-Sook Suh, Chang-Hyun Kim, | The Korean Environmental Sciences Societ | 1997 ,
25
Hepatoprotective Effects of Waxy Brown Rice Fermented with Coprinus cinereus
Hepatoprotective Effects of Waxy Brown Rice Fermented with Coprinus cinereus
Kyung-A Lee, Jong-Suk Lee, Jae-Don Yoon, Min-Wook, | Korean Societyof Food Science&Technology | 2004 ,
26
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
J.H. Choy, | 대한금속.재료학회 | 2004 ,
27
ISP liability survival guide : strategies for managing copyright, spam, cache, and privacy regulations
ISP liability survival guide : strategies for managing copyright, spam, cache, and privacy regulations
Casey, Timothy D., 005.12-C338i | Wiley & Sons | 2000 005.12-C338i,
28
Dynamic Young's Modulus and Internal Friction in Polycrystalline Copper
Dynamic Young's Modulus and Internal Friction in Polycrystalline Copper
Chang-Seog Kang,Si-Young Chang,Sung-Kil Hong, | 대한금속.재료학회 | 2003 ,
29
Dynamic Shear Stress of Tough-Pitch Copper at High Strain and High Strain-Rate
Dynamic Shear Stress of Tough-Pitch Copper at High Strain and High Strain-Rate
Moon Wonjoo,Seo Songwon,Lim Jaeyoung, Min Oakkey, | 대한기계학회 | 2002 ,
30
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Jeong-Won Yoon,Chang-Bae Lee, | 대한금속.재료학회 | 2003 ,
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Proceedings of the Royal Microscopical Society
Blackwell Publishing Limited [, ]
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Revue dEtudes Francophones
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Revue dEtudes Francophones
서울대학교 불어문화권연구소 [유럽, ]
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Revue dEtudes Francophones
서울대학교 불어문화권연구소 [프랑스어와 문학, ]
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Revue dEtudes Francophones
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Revue dEtudes Francophones
서울대학교 불어문화권연구소 [프랑스어와 문학, ]