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21
Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Jong-Woo Bae, Wonho Kim, Suk-Hyeon Cho, Yong-Woo, | 한국화학공학회 | 2000 ,
22
Effects of Temperature and pH on the Non-enzymatic Browning Reaction of Tagatose-Glycine Model System
Effects of Temperature and pH on the Non-enzymatic Browning Reaction of Tagatose-Glycine Model System
So-Young Ryu, Hoe-Jin Roh, Bong-Soo Noh, Sang-Yon, | Korean Societyof Food Science&Technology | 2003 ,
23
Finite Difference Stress Analysis of Anisotropic Three-dimensional Cueved Bodies with Free Boundaries
Finite Difference Stress Analysis of Anisotropic Three-dimensional Cueved Bodies with Free Boundaries
Han Sol Paik, Sang Youl Lee, Suk Yoou Chang, | 대한토목학회 | 2004 ,
24
Stress Distributions of Anisotropic Three-dimensional Semi-infinite Bodies by a Refined Finite Difference Formulation
Stress Distributions of Anisotropic Three-dimensional Semi-infinite Bodies by a Refined Finite Difference Formulation
Sang Youl Lee,Suk Yoon Chang, | 대한토목학회 | 2002 ,
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