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261
Use of TLD and MTLD for Control of Wind-Induced Vibration of Tall Buildings
Use of TLD and MTLD for Control of Wind-Induced Vibration of Tall Buildings
Young-Moon Kim., | 대한기계학회 | 2006 ,
262
Application of Immersed Boundary Method for Flow Over Stationary and Oscillating Cylinders
Application of Immersed Boundary Method for Flow Over Stationary and Oscillating Cylinders
Dae Sung Lee., | 대한기계학회 | 2006 ,
263
Friction Mechanisms of Silicon Wafer and Silicon Wafer Coated with Diamond like Carbon Film and Two Monolayers
Friction Mechanisms of Silicon Wafer and Silicon Wafer Coated with Diamond like Carbon Film and Two Monolayers
R. Arvind Singh., | 대한기계학회 | 2006 ,
264
Responses of Blood FFA, f-Trp, BCAAs and the Ratio of f-Trp/BCA As to an Exhaustive Exercise according to the Polymorphism of Serotonine Transporter Gene
Responses of Blood FFA, f-Trp, BCAAs and the Ratio of f-Trp/BCA As to an Exhaustive Exercise according to the Polymorphism of Serotonine Transporter Gene
Dong-Ho Park., | 체육과학연구원 | 2006 ,
265
Field Testing and Capacity-Ratings of a Short-Span Bridge Superstructures Made of Advanced Composite Materials
Field Testing and Capacity-Ratings of a Short-Span Bridge Superstructures Made of Advanced Composite Materials
Hyo Seon Ji., | 대한토목학회 | 2006 ,
266
A Low-Power ECC Check Bit Generator Implementation in DRAMs
A Low-Power ECC Check Bit Generator Implementation in DRAMs
Sand Uhn Cha., | 대한전자공학회 | 2006 ,
267
Electromigration Behaviors of SnAgCu Solder Lines
Electromigration Behaviors of SnAgCu Solder Lines
Min Seung Yoon, | 대한금속재료학회 | 2006 ,
268
Synthesis and Electrochemical Performances of LiNi(0.4)Mn(0.4)Co(0.2)O2 Cathode Material for Lithium Rechargeable Battery
Synthesis and Electrochemical Performances of LiNi(0.4)Mn(0.4)Co(0.2)O2 Cathode Material for Lithium Rechargeable Battery
Min Seung Yoon, | 대한금속재료학회 | 2006 ,
269
Fabrication of Ni-Co Alloy Nanoparticles on a Polymer Film
Fabrication of Ni-Co Alloy Nanoparticles on a Polymer Film
Jung Hoon Kim, | 대한금속재료학회 | 2006 ,
270
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Young Kun Jee, | 대한금속재료학회 | 2006 ,
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