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11
Measurement of Optical Constants for Polymerized Cholesteric Liquid Crystal Films by Using Transmittance and Reflectance Spectra
Measurement of Optical Constants for Polymerized Cholesteric Liquid Crystal Films by Using Transmittance and Reflectance Spectra
Ki Cheol YOON, | 한국물리학회 | 2006 ,
12
Syntheses and Characterization of Cr(III)-Hydrogensalicylato and -Hydroxonitrophenolato Tetraaza Macrocyclic Complexes
Syntheses and Characterization of Cr(III)-Hydrogensalicylato and -Hydroxonitrophenolato Tetraaza Macrocyclic Complexes
Jong Chul Byun, | 대한화학회 | 2006 ,
13
An Electron Heating Model for a Microwave Plasma Source
An Electron Heating Model for a Microwave Plasma Source
Deuk Chul Kwon, | 한국물리학회 | 2007 ,
14
Microstructures and Photovoltaic Properties of Wide-Gap CuGaSe₂ Solar Cells Fabricated by Using a Co-Evaporation Process
Microstructures and Photovoltaic Properties of Wide-Gap CuGaSe₂ Solar Cells Fabricated by Using a Co-Evaporation Process
Jae Ho Yun, | 한국물리학회 | 2007 ,
15
A Hybrid Solution of the Nonuniform Solenoidal-Type Inductively Coupled Plasma Heating Problem
A Hybrid Solution of the Nonuniform Solenoidal-Type Inductively Coupled Plasma Heating Problem
Deuk Chul Kwon, | 한국물리학회 | 2007 ,
16
Plastic-Based Organic Thin-Film Transistors with Thermally Cured Polymeric Gate Dielectrics
Plastic-Based Organic Thin-Film Transistors with Thermally Cured Polymeric Gate Dielectrics
Gi Heon Kim, | 한국물리학회 | 2006 ,
17
The Stucture of BC3N Tubular Nanofilber Synthesized by Using PECVD
The Stucture of BC3N Tubular Nanofilber Synthesized by Using PECVD
Ji Hoon Yang, | 한국물리학회 | 2007 ,
18
The Filtering and Phase Unwrapping of A digital Hologram
The Filtering and Phase Unwrapping of A digital Hologram
Sanghoon Shin., | 한국물리학회 | 2006 ,
19
On Optimal Sampling Design for Rainfall Field
On Optimal Sampling Design for Rainfall Field
Chulsang Yoo., | 대한토목학회 | 2006 ,
20
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Young Kun Jee, | 대한금속재료학회 | 2006 ,
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