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Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry / ...
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry

Detailed Information

자료유형  
 기사
ISSN  
12297607
저자명  
Tae Gun Kim
서명/저자  
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry / Tae Gun Kim , Nam Hoon Kim , Sang Yong Kim , Eui Goo Chang
발행사항  
서울 : 한국전기전자재료학회, 2005.
형태사항  
pp. 233-236
주기사항  
Includes Bibliography
기타저자  
Nam Hoon Kim , Sang Yong Kim , Eui Goo Chang
기본자료저록  
Transactions on Electrical and Electronic Materials : Vol.5, No.6 (2004 December) 2005, 12
원문정보  
 url
모체레코드  
모체정보확인
Control Number  
kjul:60232793

MARC

 008190927s2005        ulk                          aa    eng
■022    ▼a12297607
■1001  ▼aTae  Gun  Kim
■24510▼aOptimization  of  Removal  Rates  with  Guaranteed  Dispersion  Stability  in  Copper  CMP  Slurry▼dTae  Gun  Kim  ▼eNam  Hoon  Kim  ,  Sang  Yong  Kim  ,  Eui  Goo  Chang  
■260    ▼a서울▼b한국전기전자재료학회▼c2005.
■300    ▼app.  233-236
■500    ▼aIncludes  Bibliography
■7001  ▼aNam  Hoon  Kim  ,  Sang  Yong  Kim  ,  Eui  Goo  Chang
■773    ▼tTransactions  on  Electrical  and  Electronic  Materials▼gVol.5,  No.6  (2004  December)▼d2005,  12
■856    ▼uhttp://www.kieeme.or.kr
■SIS    ▼aS014511▼b60055341▼h8▼s2▼fP

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