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Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Detailed Information
- Material Type
- 기사
- ISSN
- 12297607
- Author
- Tae Gun Kim
- Title/Author
- Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry / Tae Gun Kim ; Nam Hoon Kim , Sang Yong Kim , Eui Goo Chang
- Publish Info
- 서울 : 한국전기전자재료학회, 2005.
- Material Info
- pp. 233-236
- General Note
- Includes Bibliography
- Added Entry-Personal Name
- Nam Hoon Kim , Sang Yong Kim , Eui Goo Chang
- Host Item Entry
- Transactions on Electrical and Electronic Materials : Vol.5, No.6 (2004 December) 2005, 12
- Electronic Location and Access
- url
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60232793
MARC
008190927s2005 ulk aa eng■022 ▼a12297607
■1001 ▼aTae Gun Kim
■24510▼aOptimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry▼dTae Gun Kim ▼eNam Hoon Kim , Sang Yong Kim , Eui Goo Chang
■260 ▼a서울▼b한국전기전자재료학회▼c2005.
■300 ▼app. 233-236
■500 ▼aIncludes Bibliography
■7001 ▼aNam Hoon Kim , Sang Yong Kim , Eui Goo Chang
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.5, No.6 (2004 December)▼d2005, 12
■856 ▼uhttp://www.kieeme.or.kr
■SIS ▼aS014511▼b60055341▼h8▼s2▼fP
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