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The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
Detailed Information
- 자료유형
- 기사
- ISSN
- 12297607
- 저자명
- Seong Min Lee
- 서명/저자
- The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling / Seong Min Lee
- 발행사항
- 서울 : 한국전기전자재료학회, 2002.
- 형태사항
- pp. 28-32
- 주기사항
- Includes Bibliography
- 원문정보
- url
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60232600
MARC
008190927s2002 ulk aa eng■022 ▼a12297607
■1001 ▼aSeong Min Lee
■24510▼aThe Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling▼dSeong Min Lee
■260 ▼a서울▼b한국전기전자재료학회▼c2002.
■300 ▼app. 28-32
■500 ▼aIncludes Bibliography
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.2, No.3 (2001 September)▼d2002, 09
■856 ▼uhttp://www.kieeme.or.kr
■SIS ▼aS014494▼b60055341▼h8▼s2▼fP
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