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The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
Detailed Information
- Material Type
- 기사
- ISSN
- 12297607
- Author
- Seong Min Lee
- Title/Author
- The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling / Seong Min Lee
- Publish Info
- 서울 : 한국전기전자재료학회, 2002.
- Material Info
- pp. 28-32
- General Note
- Includes Bibliography
- Host Item Entry
- Transactions on Electrical and Electronic Materials : Vol.2, No.3 (2001 September) 2002, 09
- Electronic Location and Access
- url
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60232600
MARC
008190927s2002 ulk aa eng■022 ▼a12297607
■1001 ▼aSeong Min Lee
■24510▼aThe Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling▼dSeong Min Lee
■260 ▼a서울▼b한국전기전자재료학회▼c2002.
■300 ▼app. 28-32
■500 ▼aIncludes Bibliography
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.2, No.3 (2001 September)▼d2002, 09
■856 ▼uhttp://www.kieeme.or.kr
■SIS ▼aS014494▼b60055341▼h8▼s2▼fP
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