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Effect of Particle Size of Ceria Coated Silica and Polishing Pressure on Chemical Mechanical Polishing of Oxide Film
Effect of Particle Size of Ceria Coated Silica and Polishing Pressure on Chemical Mechanical Polishing of Oxide Film
Detailed Information
- 자료유형
- 기사
- ISSN
- 12297607
- 저자명
- Hwan Chul Kim
- 서명/저자
- Effect of Particle Size of Ceria Coated Silica and Polishing Pressure on Chemical Mechanical Polishing of Oxide Film / Hwan Chul Kim , 공저 Hyung Mi Lim , Dae Sung Kim , Seung Ho Lee
- 발행사항
- 서울 : 한국전기전자재료학회, 2007.
- 형태사항
- pp. 167-172
- 주기사항
- 참고문헌 수록
- 원문정보
- url
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60230069
MARC
008190725s2007 ulk aa eng■022 ▼a12297607
■1001 ▼aHwan Chul Kim
■24510▼aEffect of Particle Size of Ceria Coated Silica and Polishing Pressure on Chemical Mechanical Polishing of Oxide Film▼dHwan Chul Kim▼e공저 Hyung Mi Lim , Dae Sung Kim , Seung Ho Lee
■260 ▼a서울▼b한국전기전자재료학회▼c2007.
■300 ▼app. 167-172
■500 ▼a참고문헌 수록
■7001 ▼aHyung Mi Lim , Dae Sung Kim , Seung Ho Lee
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.7, No.4 (2006 August)▼d2007, 08
■856 ▼uhttp://www.kieeme.or.kr
■SIS ▼aS036831▼b60055341▼h8▼s2▼fP
