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Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
상세정보
- 자료유형
- 기사
- ISSN
- 12297607
- 저자명
- Hyo Sang Lee
- 서명/저자
- Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP / Hyo Sang Lee , 공저 Darren DeNardis , Ara Philipossian , Yoshiyuki Seike , Mineo Takaoka , Keiji Miyachi , Shoichi Furukawa , Akio Terada , Yun Zhuang , Len Borucki
- 발행사항
- 서울 : 한국전기전자재료학회, 2008.
- 형태사항
- pp. 67-72
- 주기사항
- 참고문헌 수록
- 원문정보
- url
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60229330
MARC
008190717s2008 ulk aa eng■022 ▼a12297607
■1001 ▼aHyo Sang Lee
■24510▼aRegular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP▼dHyo Sang Lee ▼e공저 Darren DeNardis , Ara Philipossian , Yoshiyuki Seike , Mineo Takaoka , Keiji Miyachi , Shoichi Furukawa , Akio Terada , Yun Zhuang , Len Borucki
■260 ▼a서울▼b한국전기전자재료학회▼c2008.
■300 ▼app. 67-72
■500 ▼a참고문헌 수록
■7001 ▼aDarren DeNardis , Ara Philipossian , Yoshiyuki Seike , Mineo Takaoka , Keiji Miyachi , Shoichi Furukawa , Akio Terada , Yun Zhuang , Len Borucki
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.8, No.2 (2007 April)▼d2008, 04
■856 ▼uhttp://www.kieeme.or.kr
■SIS ▼aS039766▼b60055341▼h8▼s2▼fP
