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Regular Paper : Wafer Burn-in Method of SRAM for Multi Chip Package
Regular Paper : Wafer Burn-in Method of SRAM for Multi Chip Package
Detailed Information
- Material Type
- 기사
- ISSN
- 12297607
- Author
- Hoo Sung Kim
- Title/Author
- Regular Paper : Wafer Burn-in Method of SRAM for Multi Chip Package / Hoo Sung Kim ; 공저 Je Yoon Kim , Man Young Sung
- Publish Info
- 서울 : 한국전기전자재료학회, 2005.
- Material Info
- pp. 138-142
- General Note
- 참고문헌 수록
- Added Entry-Personal Name
- Je Yoon Kim , Man Young Sung
- Host Item Entry
- Transactions on Electrical and Electronic Materials : Vol.5, No.4 (2004 August) 2005, 08
- Electronic Location and Access
- url
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60229228
MARC
008190716s2005 ulk aa eng■022 ▼a12297607
■1001 ▼aHoo Sung Kim
■24510▼aRegular Paper : Wafer Burn-in Method of SRAM for Multi Chip Package▼dHoo Sung Kim▼e공저 Je Yoon Kim , Man Young Sung
■260 ▼a서울▼b한국전기전자재료학회▼c2005.
■300 ▼app. 138-142
■500 ▼a참고문헌 수록
■7001 ▼aJe Yoon Kim , Man Young Sung
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.5, No.4 (2004 August)▼d2005, 08
■856 ▼uhttp://www.kieeme.or.kr
■SIS ▼aS014509▼b60055341▼h8▼s2▼fP
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