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Regular Paper : Wafer Burn-in Method of SRAM for Multi Chip Package
Regular Paper : Wafer Burn-in Method of SRAM for Multi Chip Package
Detailed Information
- 자료유형
- 기사
- ISSN
- 12297607
- 저자명
- Hoo Sung Kim
- 서명/저자
- Regular Paper : Wafer Burn-in Method of SRAM for Multi Chip Package / Hoo Sung Kim , 공저 Je Yoon Kim , Man Young Sung
- 발행사항
- 서울 : 한국전기전자재료학회, 2005.
- 형태사항
- pp. 138-142
- 주기사항
- 참고문헌 수록
- 원문정보
- url
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60229228
MARC
008190716s2005 ulk aa eng■022 ▼a12297607
■1001 ▼aHoo Sung Kim
■24510▼aRegular Paper : Wafer Burn-in Method of SRAM for Multi Chip Package▼dHoo Sung Kim▼e공저 Je Yoon Kim , Man Young Sung
■260 ▼a서울▼b한국전기전자재료학회▼c2005.
■300 ▼app. 138-142
■500 ▼a참고문헌 수록
■7001 ▼aJe Yoon Kim , Man Young Sung
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.5, No.4 (2004 August)▼d2005, 08
■856 ▼uhttp://www.kieeme.or.kr
■SIS ▼aS014509▼b60055341▼h8▼s2▼fP
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