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Stress and Stress Voiding in Cu/Low-k Interconnects
Stress and Stress Voiding in Cu/Low-k Interconnects
Detailed Information
- 자료유형
- 기사
- ISSN
- 15981657
- 저자명
- Jong-Min Paik
- 서명/저자
- Stress and Stress Voiding in Cu/Low-k Interconnects / Jong-Min Paik , 공저 Hyun Park, Young-Chang Joo
- 발행사항
- 서울 : 대한전자공학회, 2003.
- 형태사항
- pp. 114-121
- 주기사항
- 참고문헌 수록
- 기본자료저록
- Journal of Semiconductor Technology and Science : Volume 3, Number 3, (2003 September) 2003, 09
- 원문정보
- url
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60202497
MARC
008190108s2003 ulk aa eng■022 ▼a15981657
■1001 ▼aJong-Min Paik
■24510▼aStress and Stress Voiding in Cu/Low-k Interconnects▼dJong-Min Paik▼e공저 Hyun Park, Young-Chang Joo
■260 ▼a서울▼b대한전자공학회▼c2003.
■300 ▼app. 114-121
■500 ▼a참고문헌 수록
■7001 ▼aHyun Park, Young-Chang Joo
■773 ▼tJournal of Semiconductor Technology and Science▼gVolume 3, Number 3, (2003 September)▼d2003, 09
■856 ▼ahttp://www.jsts.org
■SIS ▼aS013699▼b60054120▼h8▼s2▼fP
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