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Thermal Stability and Adhesion Improvement of Cu(Ag)/Mo Bilayer Metallization in Large-Area TFT-LCDs
Thermal Stability and Adhesion Improvement of Cu(Ag)/Mo Bilayer Metallization in Large-Area TFT-LCDs
Detailed Information
- 자료유형
- 기사
- ISSN
- 03744884
- 저자명
- H. M. Lee
- 서명/저자
- Thermal Stability and Adhesion Improvement of Cu(Ag)/Mo Bilayer Metallization in Large-Area TFT-LCDs / H. M. Lee , T. K. Hong , S. Kim , J. H. Lee , J. G. Lee , C. H. Kang , H. Ruh , J. H. Lee , D. H. Kim , C. O. Jeong , S. Y. Kim
- 발행사항
- 서울 : 한국물리학회, 2007.
- 형태사항
- pp. S702-S706
- 기타저자
- T. K. Hong
- 기타저자
- S. Kim
- 기타저자
- J. H. Lee
- 기타저자
- J. G. Lee
- 기타저자
- C. H. Kang
- 기타저자
- H. Ruh
- 기타저자
- J. H. Lee
- 기타저자
- D. H. Kim
- 기타저자
- C. O. Jeong
- 기타저자
- S. Y. Kim
- 기타저자
- S. K. Lim
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60145261
MARC
008101014s2007 ulka a eng■022 ▼a03744884
■1001 ▼aH. M. Lee
■24510▼aThermal Stability and Adhesion Improvement of Cu(Ag)/Mo Bilayer Metallization in Large-Area TFT-LCDs▼dH. M. Lee▼eT. K. Hong▼eS. Kim▼eJ. H. Lee▼e J. G. Lee▼eC. H. Kang▼eH. Ruh▼eJ. H. Lee▼eD. H. Kim▼eC. O. Jeong▼eS. Y. Kim
■260 ▼a서울▼b한국물리학회▼c2007.
■300 ▼app. S702-S706
■7001 ▼aT. K. Hong
■7001 ▼aS. Kim
■7001 ▼aJ. H. Lee
■7001 ▼aJ. G. Lee
■7001 ▼aC. H. Kang
■7001 ▼aH. Ruh
■7001 ▼aJ. H. Lee
■7001 ▼aD. H. Kim
■7001 ▼aC. O. Jeong
■7001 ▼aS. Y. Kim
■7001 ▼aS. K. Lim
■773 ▼tJournal of The Korean Physical Society▼gVol. 49 supplementary isssu III.(2006.12)▼d2007, 01
■SIS ▼aS036912▼b60077342▼h8▼s2▼fP
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