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Effects of the Size and the Concentration of the Abrasive in a Colloidal Silica (SiO2) Slurry with Added TMAH on Removal Selectivity of Polysilicon and Oxide Films in Polysilicon Chemical Mechanical Polishing
Effects of the Size and the Concentration of the Abrasive in a Colloidal Silica (SiO2) Slurry with Added TMAH on Removal Selectivity of Polysilicon and Oxide Films in Polysilicon Chemical Mechanical Polishing
Detailed Information
- 자료유형
- 기사
- ISSN
- 03744884
- 저자명
- Kyung-Woong Park
- 서명/저자
- Effects of the Size and the Concentration of the Abrasive in a Colloidal Silica (SiO2) Slurry with Added TMAH on Removal Selectivity of Polysilicon and Oxide Films in Polysilicon Chemical Mechanical Polishing / Kyung-Woong Park , Hyun-Goo Kang , Manabu Kanemoto , Jea-Gun Park , Ungyu Park
- 발행사항
- 서울 : 한국물리학회, 2007.
- 형태사항
- pp. 214-223
- 기타저자
- Hyun-Goo Kang
- 기타저자
- Manabu Kanemoto
- 기타저자
- Jea-Gun Park
- 기타저자
- Ungyu Park
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60141295
MARC
008100816s2007 ulka a eng■022 ▼a03744884
■1001 ▼aKyung-Woong Park
■24510▼aEffects of the Size and the Concentration of the Abrasive in a Colloidal Silica (SiO2) Slurry with Added TMAH on Removal Selectivity of Polysilicon and Oxide Films in Polysilicon Chemical Mechanical Polishing▼dKyung-Woong Park▼eHyun-Goo Kang▼eManabu Kanemoto▼eJea-Gun Park▼eUngyu Park
■260 ▼a서울▼b한국물리학회▼c2007.
■300 ▼app. 214-223
■7001 ▼aHyun-Goo Kang
■7001 ▼aManabu Kanemoto
■7001 ▼aJea-Gun Park
■7001 ▼aUngyu Park
■773 ▼tJournal of The Korean Physical Society▼gVol. 51 No. 1 Pt.1 (2007. 7)▼d2007, 07
■SIS ▼aS041108▼b60077342▼h8▼s2▼fP
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