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Bonding Structure and Electrical Properties of SiOC(-H) Films Deposited with a Methyltrimethoxysilane Precursor by Using Inductively Coupled Plasma Chemical Vapor Deposition
Bonding Structure and Electrical Properties of SiOC(-H) Films Deposited with a Methyltrime...
Bonding Structure and Electrical Properties of SiOC(-H) Films Deposited with a Methyltrimethoxysilane Precursor by Using Inductively Coupled Plasma Chemical Vapor Deposition

Detailed Information

자료유형  
 기사
ISSN  
03744884
저자명  
Kannan Meera.
서명/저자  
Bonding Structure and Electrical Properties of SiOC(-H) Films Deposited with a Methyltrimethoxysilane Precursor by Using Inductively Coupled Plasma Chemical Vapor Deposition / Kannan Meera. , Chang Sil Yang , Chi Kyu Choi.
발행사항  
서울 : 한국물리학회, 2006.
형태사항  
pp. 1713-1718
키워드  
BONDING STRUCTURE ELECTRICAL PROPERTIES SIOCH FILMS DEPOSITED METHYLTRIMETHOXYSILANE PRECURSOR USING INDUCTIVELY COUPLED PLASMA CHEMICAL VAPOR DEPOSITION
기타저자  
Chang Sil Yang
기타저자  
Chi Kyu Choi.
기본자료저록  
Journal of The Korean Physical Society : Vol. 48 No. 6 (2006. 6) 2006, 06
URL  
http://www.kps.or.kr
모체레코드  
모체정보확인
Control Number  
kjul:60097221

MARC

 008070413s2006        ULKa    a                          ENG
■022    ▼a03744884
■1001  ▼aKannan  Meera.
■245    ▼aBonding  Structure  and  Electrical  Properties  of  SiOC(-H)  Films  Deposited  with  a  Methyltrimethoxysilane  Precursor  by  Using  Inductively  Coupled  Plasma  Chemical  Vapor  Deposition                  ▼dKannan  Meera.  ▼eChang  Sil  Yang▼eChi  Kyu  Choi.
■260    ▼a서울▼b한국물리학회▼c2006.
■300    ▼app.  1713-1718
■653    ▼aBONDING▼aSTRUCTURE▼aELECTRICAL▼aPROPERTIES▼aSIOCH▼aFILMS▼aDEPOSITED▼aMETHYLTRIMETHOXYSILANE▼aPRECURSOR▼aUSING▼aINDUCTIVELY▼aCOUPLED▼aPLASMA▼aCHEMICAL▼aVAPOR▼aDEPOSITION
■7001  ▼aChang  Sil  Yang
■7001  ▼aChi  Kyu  Choi.
■773    ▼tJournal  of  The  Korean  Physical  Society▼gVol.  48  No.  6  (2006.  6)▼d2006,  06
■URL    ▼ahttp://www.kps.or.kr
■SIS    ▼aS028403▼b60077342▼h8▼s2

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