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Barrier Property of a TiN Layer Prepared by Using Flow Modulation CVD for Cu Metallization
Barrier Property of a TiN Layer Prepared by Using Flow Modulation CVD for Cu Metallization
Detailed Information
- Material Type
- 기사
- ISSN
- 03744884
- Author
- N. I. Cho.
- Title/Author
- Barrier Property of a TiN Layer Prepared by Using Flow Modulation CVD for Cu Metallization / N. I. Cho ; Y. Choi ; S. J. Lee ; D. Y. Lee.
- Publish Info
- 서울 : 한국물리학회, 2006.
- Material Info
- pp. 1620-1623
- Index Term-Uncontrolled
- BARRIER PROPERTY LAYER PREPARED USING FLOW MODULATION CVD CU METALLIZATION
- Added Entry-Personal Name
- Y. Choi
- Added Entry-Personal Name
- S. J. Lee
- Added Entry-Personal Name
- D. Y. Lee.
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60097200
MARC
008070413s2006 ULKa a ENG■022 ▼a03744884
■1001 ▼aN. I. Cho.
■245 ▼aBarrier Property of a TiN Layer Prepared by Using Flow Modulation CVD for Cu Metallization ▼dN. I. Cho▼eY. Choi▼eS. J. Lee▼eD. Y. Lee.
■260 ▼a서울▼b한국물리학회▼c2006.
■300 ▼app. 1620-1623
■653 ▼aBARRIER▼aPROPERTY▼aLAYER▼aPREPARED▼aUSING▼aFLOW▼aMODULATION▼aCVD▼aCU▼aMETALLIZATION
■7001 ▼aY. Choi
■7001 ▼aS. J. Lee
■7001 ▼aD. Y. Lee.
■773 ▼tJournal of The Korean Physical Society▼gVol. 48 No. 6 (2006. 6)▼d2006, 06
■URL ▼ahttp://www.kps.or.kr
■SIS ▼aS028403▼b60077342▼h8▼s2
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