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Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Detailed Information
- 자료유형
- 기사
- ISSN
- 17388090
- 저자명
- Yong Min Kwon
- 서명/저자
- Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM / Yong Min Kwon , Young Doo Jeon , Kyung Wook Paik
- 발행사항
- 서울 : 대한금속재료학회, 2006.
- 형태사항
- pp. 37-42
- 기타저자
- Young Doo Jeon
- 기타저자
- Kyung Wook Paik
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60092668
MARC
008070309s2006 ULKa a ENG■022 ▼a17388090
■1001 ▼aYong Min Kwon
■245 ▼aBrittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM▼dYong Min Kwon▼eYoung Doo Jeon▼eKyung Wook Paik
■260 ▼a서울▼b대한금속재료학회▼c2006.
■300 ▼app. 37-42
■653 ▼aBRITTLE▼aFAILURE▼aEFFECT▼aTHERMAL▼aAGING▼aPBFREE▼aSOLDER▼aFLIP▼aCHIP▼aUSING▼aELECTROLESS▼aNIP▼aUBM
■7001 ▼aYoung Doo Jeon
■7001 ▼aKyung Wook Paik
■773 ▼tELECTRONIC MATERIALS Letters▼gVol. 2 No. 1▼d2006, 03
■SIS ▼aS028679▼b60077032▼h8▼s2
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