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Electromigration Behaviors of SnAgCu Solder Lines
Electromigration Behaviors of SnAgCu Solder Lines
Detailed Information
- Material Type
- 기사
- ISSN
- 17388090
- Author
- Min Seung Yoon
- Title/Author
- Electromigration Behaviors of SnAgCu Solder Lines / Min Seung Yoon ; Min Ku Ko ; Oh Han Kim
- Publish Info
- 서울 : 대한금속재료학회, 2006.
- Material Info
- pp. 127-130
- Index Term-Uncontrolled
- ELECTROMIGRATION BEHAVIORS SNAGCU SOLDER LINES
- Added Entry-Personal Name
- Min Ku Ko
- Added Entry-Personal Name
- Oh Han Kim
- Host Item Entry
- ELECTRONIC MATERIALS Letters : Vol. 2 No. 2 2006, 06
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60092654
MARC
008070309s2006 ULKa a ENG■022 ▼a17388090
■1001 ▼aMin Seung Yoon
■245 ▼aElectromigration Behaviors of SnAgCu Solder Lines▼dMin Seung Yoon▼eMin Ku Ko▼eOh Han Kim
■260 ▼a서울▼b대한금속재료학회▼c2006.
■300 ▼app. 127-130
■653 ▼aELECTROMIGRATION▼aBEHAVIORS▼aSNAGCU▼aSOLDER▼aLINES
■7001 ▼aMin Ku Ko
■7001 ▼aOh Han Kim
■773 ▼tELECTRONIC MATERIALS Letters▼gVol. 2 No. 2▼d2006, 06
■SIS ▼aS028763▼b60077032▼h8▼s2
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