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Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Detailed Information
- 자료유형
- 기사
- ISSN
- 17388090
- 저자명
- K. W. Lee
- 서명/저자
- Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages / K. W. Lee , M. A. Gaynes , E. Duchesne
- 발행사항
- 서울 : 대한금속재료학회, 2006.
- 형태사항
- pp. 171-174
- 기타저자
- M. A. Gaynes
- 기타저자
- E. Duchesne
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60092623
MARC
008070309s2006 ULKa a ENG■022 ▼a17388090
■1001 ▼aK. W. Lee
■245 ▼aChip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages▼dK. W. Lee▼eM. A. Gaynes▼eE. Duchesne
■260 ▼a서울▼b대한금속재료학회▼c2006.
■300 ▼app. 171-174
■653 ▼aCHIPUNDERFILL▼aINTERFACES▼aFLIP▼aCHIP▼aPLASTIC▼aBALL▼aGRID▼aARRAY▼aPACKAGES
■7001 ▼aM. A. Gaynes
■7001 ▼aE. Duchesne
■773 ▼tELECTRONIC MATERIALS Letters▼gVol. 2 No. 3▼d2006, 12
■SIS ▼aS037322▼b60077032▼h8▼s2
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