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Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Detailed Information
- Material Type
- 기사
- ISSN
- 17388090
- Author
- Young Kun Jee
- Title/Author
- Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads / Young Kun Jee ; Yong Ho Ko ; Yoon Chul Sohn
- Publish Info
- 서울 : 대한금속재료학회, 2006.
- Material Info
- pp. 161-166
- Index Term-Uncontrolled
- EFFECTS ZN ADDITION INTERFACE MICROSTRUCTURE DROP RELIABILITY SN3.5AG SOLDER CU PADS
- Added Entry-Personal Name
- Yong Ho Ko
- Added Entry-Personal Name
- Yoon Chul Sohn
- Host Item Entry
- ELECTRONIC MATERIALS Letters : Vol. 2 No. 3 2006, 12
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60092621
MARC
008070309s2006 ULKa a ENG■022 ▼a17388090
■1001 ▼aYoung Kun Jee
■245 ▼aEffects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads▼dYoung Kun Jee▼eYong Ho Ko▼eYoon Chul Sohn
■260 ▼a서울▼b대한금속재료학회▼c2006.
■300 ▼app. 161-166
■653 ▼aEFFECTS▼aZN▼aADDITION▼aINTERFACE▼aMICROSTRUCTURE▼aDROP▼aRELIABILITY▼aSN3.5AG▼aSOLDER▼aCU▼aPADS
■7001 ▼aYong Ho Ko
■7001 ▼aYoon Chul Sohn
■773 ▼tELECTRONIC MATERIALS Letters▼gVol. 2 No. 3▼d2006, 12
■SIS ▼aS037322▼b60077032▼h8▼s2
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