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Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Detailed Information
- Material Type
- 기사
- ISSN
- 17388090
- Author
- Tae Kyu Lee
- Title/Author
- Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections / Tae Kyu Lee ; Fay Hua ; J. W. Morris
- Publish Info
- 서울 : 대한금속재료학회, 2006.
- Material Info
- pp. 157-160
- Index Term-Uncontrolled
- HEAT EFFECT IMPACT RESISTANCE ELECTROMIGRATION CUSN INTERCONNECTIONS
- Added Entry-Personal Name
- Fay Hua
- Added Entry-Personal Name
- J. W. Morris
- Host Item Entry
- ELECTRONIC MATERIALS Letters : Vol. 2 No. 3 2006, 12
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60092620
MARC
008070309s2006 ULKa a ENG■022 ▼a17388090
■1001 ▼aTae Kyu Lee
■245 ▼aHeat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections▼dTae Kyu Lee▼eFay Hua▼eJ. W. Morris
■260 ▼a서울▼b대한금속재료학회▼c2006.
■300 ▼app. 157-160
■653 ▼aHEAT▼aEFFECT▼aIMPACT▼aRESISTANCE▼aELECTROMIGRATION▼aCUSN▼aINTERCONNECTIONS
■7001 ▼aFay Hua
■7001 ▼aJ. W. Morris
■773 ▼tELECTRONIC MATERIALS Letters▼gVol. 2 No. 3▼d2006, 12
■SIS ▼aS037322▼b60077032▼h8▼s2
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