서브메뉴
검색
Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film
Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film
Detailed Information
- 자료유형
- 기사
- ISSN
- 12297607
- 저자명
- Kim, Hwan-Chul
- 서명/저자
- Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film / Hwan-Chul Kim , by Hyung Mi Lim , Dae-Sung Kim , Seung-Ho Lee
- 발행사항
- 서울 : 한국전기전자재료학회, 2007.
- 형태사항
- pp. 167-172
- 기타저자
- Lim, Hyung Mi
- 기타저자
- Kim, Dae-Sung
- 기타저자
- Lee, Seung-Ho
- Control Number
- kjul:60085890
MARC
008061213s2007 ULKa a ENG■022 ▼a12297607
■1001 ▼aKim, Hwan-Chul
■245 ▼aEffect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film▼dHwan-Chul Kim▼eby Hyung Mi Lim▼eDae-Sung Kim▼eSeung-Ho Lee
■260 ▼a서울▼b한국전기전자재료학회▼c2007.
■300 ▼app. 167-172
■653 ▼aEFFECT▼aPARTICLE▼aSIZE▼aCERIA▼aCOATED▼aSILICA▼aPOLISHING▼aPRESSURE▼aCHEMICAL▼aMECHANICAL▼aOXIDE▼aFILM
■7001 ▼aLim, Hyung Mi
■7001 ▼aKim, Dae-Sung
■7001 ▼aLee, Seung-Ho
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.7, No.4 (2006 August)▼d2007, 08
■■URL ▼ahttp://www.kieeme.or.kr
