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Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film
Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film
Detailed Information
- Material Type
- 기사
- ISSN
- 12297607
- Author
- Kim, Hwan-Chul
- Title/Author
- Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film / Hwan-Chul Kim ; by Hyung Mi Lim ; Dae-Sung Kim ; Seung-Ho Lee
- Publish Info
- 서울 : 한국전기전자재료학회, 2007.
- Material Info
- pp. 167-172
- Index Term-Uncontrolled
- EFFECT PARTICLE SIZE CERIA COATED SILICA POLISHING PRESSURE CHEMICAL MECHANICAL OXIDE FILM
- Added Entry-Personal Name
- Lim, Hyung Mi
- Added Entry-Personal Name
- Kim, Dae-Sung
- Added Entry-Personal Name
- Lee, Seung-Ho
- Host Item Entry
- Transactions on Electrical and Electronic Materials : Vol.7, No.4 (2006 August) 2007, 08
- Control Number
- kjul:60085890
MARC
008061213s2007 ULKa a ENG■022 ▼a12297607
■1001 ▼aKim, Hwan-Chul
■245 ▼aEffect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film▼dHwan-Chul Kim▼eby Hyung Mi Lim▼eDae-Sung Kim▼eSeung-Ho Lee
■260 ▼a서울▼b한국전기전자재료학회▼c2007.
■300 ▼app. 167-172
■653 ▼aEFFECT▼aPARTICLE▼aSIZE▼aCERIA▼aCOATED▼aSILICA▼aPOLISHING▼aPRESSURE▼aCHEMICAL▼aMECHANICAL▼aOXIDE▼aFILM
■7001 ▼aLim, Hyung Mi
■7001 ▼aKim, Dae-Sung
■7001 ▼aLee, Seung-Ho
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.7, No.4 (2006 August)▼d2007, 08
■■URL ▼ahttp://www.kieeme.or.kr
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