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오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning
오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning / 최은석, 배소익 저.
오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning

Detailed Information

자료유형  
 기사
ISSN  
12250562
서명/저자  
오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning / 최은석, 배소익 저.
발행사항  
서울 : 한국재료학회, 2006.
형태사항  
pp. 75-79
키워드  
오존 초음파 이용 실리콘 웨이퍼 POST SLICED CLEANING
기타저자  
최은석
기타저자  
배소익
기본자료저록  
한국재료학회지(Korean Journal of Materials Research) : Vol. 16, No. 2, (2006 February) 2006, 02
URL  
http://mrs-k.or.kr
모체레코드  
모체정보확인
Control Number  
kjul:60077934

MARC

 008060912s2006        ULKa    a                          KOR
■022    ▼a12250562
■245    ▼a오존과  초음파를  이용한  실리콘  웨이퍼의  Post  Sliced  Cleaning▼d최은석,  배소익  저.
■260    ▼a서울▼b한국재료학회▼c2006.
■300    ▼app.  75-79
■653    ▼a오존▼a초음파▼a이용▼a실리콘▼a웨이퍼▼aPOST▼aSLICED▼aCLEANING
■700    ▼a최은석
■700    ▼a배소익
■773    ▼t한국재료학회지(Korean  Journal  of  Materials  Research)▼gVol.  16,  No.  2,  (2006  February)▼d2006,  02
■URL    ▼ahttp://mrs-k.or.kr
■SIS    ▼aS021077▼b60055267▼h8▼s2

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