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Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Detailed Information
- 자료유형
- 기사
- ISSN
- 15989623
- 서명/저자
- Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes / Jae Woong Choi, Gil Ho Hwang, Won Kyu Han, Sung Goon Kang
- 발행사항
- 서울 : Korean Institute of Metals and Materials, 2006.
- 형태사항
- pp. 75-80
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60076638
MARC
008060530s2006 ULKa a ENG■022 ▼a15989623
■245 ▼aPre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes▼dJae Woong Choi, Gil Ho Hwang, Won Kyu Han, Sung Goon Kang
■260 ▼a서울▼bKorean Institute of Metals and Materials▼c2006.
■300 ▼app. 75-80
■653 ▼aPREANNEALING▼aEFFECT▼aELECTROLESS▼aNIB▼aDEPOSIT▼aDIFFUSION▼aBARRIER▼aELECTROPLATED▼aCU▼aELECTRODES
■700 ▼aJae Woong Choi, Gil Ho Hwang, Won Kyu Han, Sung Goon Kang
■773 ▼tMetals and Materials international▼gVOL.12 NO.1 (2006 FEBRUARY)▼d2006, 02
■URL ▼ahttp://www.kim.or.kr
■SIS ▼aS025142▼b60013551▼h8▼s2
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