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Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Detailed Information
- 자료유형
- 기사
- ISSN
- 12269360
- 서명/저자
- Thermal Transient Characteristics of Die Attach in High Power LED Package / Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Young-Gi Lee, Seok-Moon Choi, Yong-Soo Oh 공저
- 발행사항
- 서울 : 한국마이크로전자및 패키징학회, 2005.
- 형태사항
- pp. 331-338
- 기본자료저록
- 마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack : 2005 Vol. 12 No.4 ((37)) 2005, 12
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075331
MARC
008060503s2005 ULKa a KOR■022 ▼a12269360
■245 ▼aThermal Transient Characteristics of Die Attach in High Power LED Package▼dHyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Young-Gi Lee, Seok-Moon Choi, Yong-Soo Oh 공저
■260 ▼a서울▼b한국마이크로전자및 패키징학회▼c2005.
■300 ▼app. 331-338
■653 ▼aTHERMAL▼aTRANSIENT▼aCHARACTERISTICS▼aATTACH▼aHIGH▼aPOWER▼aLED▼aPACKAGE
■700 ▼aHyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Young-Gi Lee, Seok-Moon Choi, Yong-Soo Oh
■773 ▼t마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack▼g2005 Vol. 12 No.4 ((37))▼d2005, 12
■URL ▼ahttp://www.imapsk.or.kr
■SIS ▼aS023547▼b60075252▼h8▼s2
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