서브메뉴
검색
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Detailed Information
- 자료유형
- 기사
- ISSN
- 12269360
- 서명/저자
- Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling / J. S. Bae, G. H. Chang, J. H. Lee
- 발행사항
- 서울 : 한국마이크로전자및 패키징학회, 2005.
- 형태사항
- pp. 129-134
- 기본자료저록
- 마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack : 2005 Vol. 12 No.2 ((35)) 2005, 06
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075299
MARC
008060503s2005 ULKa a KOR■022 ▼a12269360
■245 ▼aElectroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling▼dJ. S. Bae, G. H. Chang, J. H. Lee
■260 ▼a서울▼b한국마이크로전자및 패키징학회▼c2005.
■300 ▼app. 129-134
■653 ▼aELECTROPLATING▼aCOPPER▼aUSING▼aPULSEREVERSE▼aMETHOD▼aSIP▼aVIA▼aFILLING
■700 ▼aJ. S. Bae, G. H. Chang, J. H. Lee
■773 ▼t마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack▼g2005 Vol. 12 No.2 ((35))▼d2005, 06
■URL ▼ahttp://www.imapsk.or.kr
■SIS ▼aS023545▼b60075252▼h8▼s2
Preview
Export
ChatGPT Discussion
AI Recommended Related Books
Info Détail de la recherche.
- Réservation
- n'existe pas
- My Folder
- Reference Materials for Thesis Writing
- Reference Materials for Research Ethics
- Job-Related Books
