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Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Detailed Information
- 자료유형
- 기사
- ISSN
- 12269360
- 서명/저자
- Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders / Joo Won Lee, Sung K. Kang, Hyuck Mo Lee
- 발행사항
- 서울 : 한국마이크로전자및 패키징학회, 2005.
- 형태사항
- pp. 121-128
- 기본자료저록
- 마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack : 2005 Vol. 12 No.2 ((35)) 2005, 06
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075298
MARC
008060503s2005 ULKa a KOR■022 ▼a12269360
■245 ▼aEffects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders ▼dJoo Won Lee, Sung K. Kang, Hyuck Mo Lee
■260 ▼a서울▼b한국마이크로전자및 패키징학회▼c2005.
■300 ▼app. 121-128
■653 ▼aEFFECTS▼aTEMPERATURE▼aMECHANICAL▼aDEFORMATION▼aMICROHARDNESS▼aLEAD▼aFREE▼aCOMPOSITE▼aSOLDERS
■700 ▼aJoo Won Lee, Sung K. Kang, Hyuck Mo Lee
■773 ▼t마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack▼g2005 Vol. 12 No.2 ((35))▼d2005, 06
■URL ▼ahttp://www.imapsk.or.kr
■SIS ▼aS023545▼b60075252▼h8▼s2
