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Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Detailed Information
- 자료유형
- 기사
- ISSN
- 12269360
- 서명/저자
- Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging / Moon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-Gyu Kim
- 발행사항
- 서울 : 한국마이크로전자및 패키징학회, 2005.
- 형태사항
- pp. 95-104
- 기본자료저록
- 마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack : 2005 Vol. 12 No.2 ((35)) 2005, 06
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075294
MARC
008060503s2005 ULKa a KOR■022 ▼a12269360
■245 ▼aInterfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging▼dMoon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-Gyu Kim
■260 ▼a서울▼b한국마이크로전자및 패키징학회▼c2005.
■300 ▼app. 95-104
■653 ▼aINTERFACIAL▼aREACTION▼a42SN58BI▼aSOLDER▼aELECTROLESS▼aNIPIMMERSION▼aUBM▼aAGING
■700 ▼aMoon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-Gyu Kim
■773 ▼t마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack▼g2005 Vol. 12 No.2 ((35))▼d2005, 06
■URL ▼ahttp://www.imapsk.or.kr
■SIS ▼aS023545▼b60075252▼h8▼s2
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