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Effect of Microstructure on Alternating Current-induced Damage in Cu Lines
Effect of Microstructure on Alternating Current-induced Damage in Cu Lines
Detailed Information
- 자료유형
- 기사
- ISSN
- 12269360
- 서명/저자
- Effect of Microstructure on Alternating Current-induced Damage in Cu Lines / Young Bae Park
- 발행사항
- 서울 : 한국마이크로전자및 패키징학회, 2005.
- 형태사항
- pp. 27-34
- 기타저자
- Young Bae Park
- 기본자료저록
- 마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack : 2005 Vol. 12 No.1 ((34)) 2005, 03
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075282
MARC
008060503s2005 ULKa a KOR■022 ▼a12269360
■245 ▼aEffect of Microstructure on Alternating Current-induced Damage in Cu Lines▼dYoung Bae Park
■260 ▼a서울▼b한국마이크로전자및 패키징학회▼c2005.
■300 ▼app. 27-34
■653 ▼aEFFECT▼aMICROSTRUCTURE▼aALTERNATING▼aCURRENTINDUCED▼aDAMAGE▼aCU▼aLINES
■700 ▼aYoung Bae Park
■773 ▼t마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack▼g2005 Vol. 12 No.1 ((34))▼d2005, 03
■URL ▼ahttp://www.imapsk.or.kr
■SIS ▼aS023544▼b60075252▼h8▼s2
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